1.CW-14 copper polishing additive is compounded by corrosion inhibitor, nitrogen oxide gas absorbent and surfactant
2. The effect is moderate, the substrate is weakly etched, the operating environment is good, and the process meets the requirements of clean production.
Using parameters
Copper | Brass | |
Sulfuric acid | 400ml/L | 400ml/L |
Sodium nitrate | 65g/L | 65g/L |
Sodium chloride | 3.5g/L | 3.5g/L |
CW-14 | 8-15ml/L | 15-22ml/L |
Temperature | Room temperature | Room temperature |
Time | 30-120 seconds | 30-120 seconds |
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